Optimizing process window robustness with reconfigurable OPC. (cover story)
- Resource Type
- Article
- Authors
- Anderson, Melissa; Ma, Melody; Vikram, Abhishek; Volk, William; Andrews, Scott; Bo Su
- Source
- Solid State Technology. Jun2006, Vol. 49 Issue 6, p75-80. 4p.
- Subject
- *PROXIMITY detectors
*INTEGRATED circuit verification
*CALIBRATION
*MANUFACTURING processes
*OPTICAL measurements
*MANUFACTURING defects
*LITHOGRAPHY
- Language
- ISSN
- 0038-111X
The article focuses on the reconfigurable optical proximity correction (OPC) approach to improve process window robustness for sub-100-nanometer designs. A physics-based method for lithography process window verification is used to give better accuracy at off-focus and off-exposure conditions and to reduce calibration efforts. According to the article, the optical proximity corrections applied to fix the programmed defects have the same quality with the original corrections.