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2021 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP), 2021 Symposium on. :1-5 Aug, 2021
2018 12th International Conference on the Properties and Applications of Dielectric Materials (ICPADM) Properties and Applications of Dielectric Materials (ICPADM), 2018 12th International Conference on the. :483-486 May, 2018