Size-Controlled Low-Melting-Point-Alloy Particle-Incorporated Transient Liquid-Phase Epoxy Composite Conductive Adhesive with High Performances.
- Resource Type
- Article
- Source
- ACS Applied Polymer Materials; 4/14/2023, Vol. 5 Issue 4, p2760-2773, 14p
- Subject
- Language
- ISSN
- 26376105