학술논문

1 . Academic Journal

The anti-electrochemical migration mechanism of Ag-based transient liquid-phase electrically conductive adhesive: Experimental and phase-field study

저자: by Zhao, Shuang; Yang, Mingkun; Liu, Yingxia; Cao, Chenrui; Liang, Chen, et al.
소스: In Applied Surface Science 1 July 2025 696

7 . Academic Journal

Robust lithium-ion battery state of health estimation based on recursive feature elimination-deep Bidirectional long short-term memory model using partial charging data

저자: by Tian, Fengxun; Chen, Shuwen; Ji, Xiaofan; Xu, Jiongyuan; Yang, Mingkun, et al.
소스: In International Journal of Electrochemical Science January 2025 20(1)

7 . Academic Journal

Dynamic shape-shifting of the single-celled eukaryotic predator Lacrymaria via unconventional cytoskeletal components

저자: by Qin, Weiwei; Hu, Che; Gu, Siyu; Zhang, Jing; Jiang, Chuanqi, et al.
소스: In Current Biology 4 November 2024 34(21):4869-4883

7 . Academic Journal

Class-Aware Mask-guided feature refinement for scene text recognition

저자: by Yang, Mingkun; Yang, Biao; Liao, Minghui; Zhu, Yingying; Bai, Xiang.
소스: In Pattern Recognition May 2024 149

7 . Academic Journal

Association between the dietary inflammatory index and all-cause and cardiovascular mortality in patients with atherosclerotic cardiovascular disease

저자: by Yang, Mingkun; Miao, Shenhui; Hu, Weihang; Yan, Jing.
소스: In Nutrition, Metabolism and Cardiovascular Diseases April 2024 34(4):1046-1053

6 . Academic Journal

Sequential visual and semantic consistency for semi-supervised text recognition

저자: by Yang, Mingkun; Yang, Biao; Liao, Minghui; Zhu, Yingying; Bai, Xiang.
소스: In Pattern Recognition Letters February 2024 178:174-180

7 . Conference

Effect of Size-Controlled Low-Melting-Point-Alloy Particle-Incorporated on the Reliability of Transient Liquid Phase Epoxy Composite Conductive Adhesive

저자: by Liang, Chen; Yang, Mingkun; Wang, Zhiteng; Wan, Cheng; Xu, Shimeng, et al.
소스: 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2024 IEEE 26th. :991-996 Dec, 2024

Full Text (IEEE)

7 . Academic Journal

A phase-field model of electrochemical migration for silver-based conductive adhesives

저자: by Cao, Chenrui; Yang, Mingkun; Liang, Chen; Zhang, Donglin; Chen, Xin, et al.
소스: In Electrochimica Acta 10 December 2023 471

7 . Academic Journal

A bacteria-derived tetramerized protein ameliorates nonalcoholic steatohepatitis in mice via binding and relocating acetyl-coA carboxylase

저자: by Lin, Yan; Yang, Mingkun; Huang, Li; Yang, Fan; Fan, Jiachen, et al.
소스: In Cell Reports 28 November 2023 42(11)

7 . Academic Journal

Room-temperature, rapid, solid-state solder bonding technology for future ultra-high-density interconnects manufacturing

저자: by Yang, Mingkun; Huo, Yongjun; Zhao, Xiuchen; Guo, Yuzheng; Liu, Yingxia.
소스: In Journal of Materials Research and Technology July-August 2023 25:999-1010

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