acs applied materials & interfaces (15)
2019 6th international workshop on low temperature bonding for 3d integration (ltb-3d), low temperature bonding for 3d integration (ltb-3d), 2019 6th international workshop on (6)
applied surface science (5)
crystal growth & design (4)
ecs transactions (4)
npj materials degradation (4)
physica status solidi. a: applications & materials science (4)
computational materials science (3)
ieee transactions on electron devices (3)
japanese journal of applied physics (3)
molecules (3)
science china information sciences (3)
scripta materialia (3)
2011 12th international conference on electronic packaging technology and high density packaging, electronic packaging technology and high density packaging (icept-hdp), 2011 12th international conference on (2)
2019 international conference on electronics packaging (icep), electronics packaging (icep), 2019 international conference on (2)
aip advances (2)
apl materials (2)
applied physics letters (2)
ceramics international (2)
fundamental research (2)
journal of alloys & compounds (2)
journal of alloys and compounds (2)
journal of materials science & technology (2)
journal of materials science: materials in electronics (2)
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materials (1996-1944) (2)
micromachines (2)
physica status solidi (a) - applications and materials science (2)
science china physics, mechanics & astronomy (2)
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2014 4th ieee international workshop on low temperature bonding for 3d integration (ltb-3d) (1)
2014 4th ieee international workshop on low temperature bonding for 3d integration (ltb-3d), low temperature bonding for 3d integration (ltb-3d), 2014 4th ieee international workshop on (1)
2015 international conference on electronic packaging & imaps all asia conference (icep-iaac) (1)
2015 international conference on electronics packaging and imaps all asia conference (icep-iaac), electronics packaging and imaps all asia conference (icep-iacc), 2015 international conference on (1)
2017 18th international conference on electronic packaging technology (icept), electronic packaging technology (icept), 2017 18th international conference on (1)
2017 5th international workshop on low temperature bonding for 3d integration (ltb-3d), low temperature bonding for 3d integration (ltb-3d), 2017 5th international workshop on (1)
2018 19th international conference on electronic packaging technology (icept), electronic packaging technology (icept), 2018 19th international conference on (1)
2018 7th electronic system-integration technology conference (estc), electronic system-integration technology conference (estc), 2018 7th (1)
2018 international conference on electronics packaging and imaps all asia conference (icep-iaac), electronics packaging and imaps all asia conference (icep-iaac), 2018 international conference on (1)
2019 ieee 69th electronic components and technology conference (ectc), electronic components and technology conference (ectc), 2019 ieee 69th (1)
2019 ieee international electron devices meeting (iedm), electron devices meeting (iedm), 2019 ieee international (1)
advanced materials interfaces (1)
applied physics express (1)
materialia (1)
materials transactions (1)
metals (1)
metals (2075-4701) (1)
physica status solidi a-applications and materials science (1)
science china-physics mechanics & astronomy (1)
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