Amorphous NbS2was proposed as the resistive switching (RS) layer for conductive‐bridge random access memory (CBRAM) for the first time, with Cu and Au as the top and bottom electrodes, respectively. NbS2films were prepared at room temperature, which exhibited an amorphous structure and did not crystalize even annealed at 500°C, showing good thermal stability. The amorphous NbS2CBRAM devices present stable bipolar non‐volatile RS characteristics. Repetitive RS behavior is demonstrated in amorphous NbS2CBRAMs. The operating voltage during all RS cycles is less than 1 V, demonstrating that the NbS2CBRAM is a low‐operation voltage memory device. The distribution of the high and low resistive state resistance is relatively concentrated, and the on‐off ratio has been kept above 100, offering a sufficient data read/write window. The formation and fracture of the Cu metal conductive filament is considered to be the RS mechanism by analyzing the dependence of current and voltage in logarithmic coordinates. Our study demonstrated that amorphous NbS2is a promising material for low‐operation voltage CBRAM. Amorphous NbS2films were proposed for producing CBRAMs, presenting stable bipolar resistive switching characteristics with operation voltage below 1 V and HRS/LRS ratio up to 100. Repetitive resistive switching behavior is demonstrated in a‐NbS2CBRAM devices. The electrochemical redox reaction of Cu, as well as the formation and fracture of Cu metal CF, is the resistive switching mechanism.