A clip for mounting a component such as a heat sink to a support such as a printed circuit board, in particular to stabilize the position of the component until the clip can be soldered to the support, includes a securing portion having a pair of feet received in the support and a supporting portion having a pair of arms received in the component in an interference fit. According to a preferred embodiment, the feet are separated by a slit and are formed into parallel planes so that the feet can overlap when compressed toward each other during insertion into a hole in a printed circuit board, and have outward facing barbs which engage the printed circuit board.