In order to enhance the wet property of a copper surface in water for use in manufacturing of integrated circuits for electric equipment, a thin film of thiol-type telechelics such as oligo(2-methyl-2-oxazoline) (OMeOZO) having a triazinethiol moiety on the oligomer end was prepared on the surface of a copper plate and then the resulted thin film was examined. First, the telechelics was synthesized by utilizing termination of the living OMeOZO prepared by the cationic ring-opening polymerization of 2-methyl-2-oxazoline (MeOZO) with triazinethiol. As a reference, mono MeOZO telechelics was also synthesized by the reaction of MeOZO with triazinethiol at 1:1 molar ratio. Then, the copper plate was dipped in the prepared telechelics solution to form the telechelics coating film on its surface. This coating was carried out by two ways, in which the adding order of the reagents was different. Changes in the surface properties of the resultant film on a copper plate were examined by the measurement of water contact angle, atomic force microscopy (AFM), and X-ray photoelectron spectroscopy (XPS). From the measurement of contact angle, the copper plate surface modified with OMeOZO was found to be much more hydrophilic compared to the reference. In addition, the state of the resultant telechelics film on the treated surface of a copper plate was elucidated by AFM observation and XPS analysis.