Evolution of High-Temperature and Low-Temperature High Strain Rate Properties for SAC-R after Sustained Exposure to 50°C
- Resource Type
- Conference
- Authors
- Lall, Pradeep; Saha, Mrinmoy; Suhling, Jeff; Blecker, Ken
- Source
- 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022 21st IEEE Intersociety Conference on. :1-12 May, 2022
- Subject
- Aerospace
Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Computing and Processing
Engineered Materials, Dielectrics and Plasmas
Photonics and Electrooptics
Power, Energy and Industry Applications
Robotics and Control Systems
Transportation
Temperature measurement
Degradation
Temperature distribution
Biological system modeling
Computational modeling
Predictive models
Aging
SAC-R
High strain rate Testing
Low temperature testing
Thermal aging
Anand Viscoplastic Model
Stress Strain curves. Lead Free Solder joint
- Language
- ISSN
- 2694-2135
Electronic parts in military, automotive, avionics and space applications may be subjected to sustained operation at high temperature in addition to high strain-rate loads. Parts may be stored in non-climate-controlled enclosures prior to deployment. Earlier studies on undoped SAC alloys have shown that the material properties evolve after prolonged period of storage at even modest temperatures. In order to mitigate the aging effects, a number of alloy formulation have been proposed. Data of the mechanical properties of lead-free solder alloys which is used for interconnection in the electronic packaging at high strain rates and at high storage temperature is very essential for design optimization of electronic package sustainability at extreme temperature environment because the SAC solders have shown to have degradation in mechanical properties at prolonged exposure to storage temperature. Industries have come up with a solution to reduce the degradation using dopants in SAC solder. In this study, a doped SAC solder called SAC-R (Ecolloy) has been subjected to high strain rate testing after keeping them in storage at temperature of 50°C for 1 - 8months. Samples with no aging and aged samples for up to 8-months have been subjected to uniaxial tensile tests to measure the mechanical properties of SAC-R for High and Low operating temperature ranging from -65°C to 200°C. The material data has been used to compute the constants for the Anand Visco-Plasticity model. The ability of the model to represent the material constitutive behavior has been quantified by comparing the model predictions of the uniaxial tensile test with the experimental data