DFI Filler Cells – New Embedded Type of Test Structures for Non-Contact Detection of Electrical Defects on Product Wafers
- Resource Type
- Conference
- Authors
- Lam, Stephen; Hess, Christopher; Weiland, Larg; Moe, Matthew; Shen, Xumin William; Chen, John; De, Indranil; Strojwas, Marcin; Brozek, Tomasz
- Source
- 2022 IEEE 34th International Conference on Microelectronic Test Structures (ICMTS) Microelectronic Test Structures (ICMTS), 2022 IEEE 34th International Conference on. :1-6 Mar, 2022
- Subject
- Components, Circuits, Devices and Systems
Computing and Processing
Engineered Materials, Dielectrics and Plasmas
General Topics for Engineers
Signal Processing and Analysis
Process monitoring
Inspection
Logic design
Microelectronics
Standards
Test Structure
E-beam
Defect
Characterization
Standard Cells
Yield
- Language
- ISSN
- 2158-1029
A new type of test structures has been developed for process monitoring and defect detection on product wafers. The structures are part of PDF Solutions’ proprietary Design-for-Inspection™ (DFI) system. They electrically tested in a non-contact way using a dedicated and specially optimized e-Beam tool. They are designed to be compatible with standard cells and to be used as filler cells in standard cell-based logic designs. The paper presents the design and usage of such DFI structures as well as illustrated results collected from scanning product wafers containing embedded DFI filler cells.