In order to ensure the using life requirements of the whole machine, it is necessary to predict the reliability of the internal chip components of the whole machine under the same environmental stress. According to the experimental results, we can try to eliminate the problem that the service life of the whole machine is reduced due to the failure of the chip component. The reliability life expectancy can increase the failure process of internal chip components and can reflect the problems of the chip more quickly. For a new chip component, the reliability index is unknown, which needs us to study and determine the stress cycle type and specific stress parameters of the environmental test, to judge its reliability. This article aims the airborne T/R component chip as an example, and studies, determines and evaluates its reliability index under Aircraft installed conditions. According to different operating conditions, the environmental stress screening test and the environmental adaptability test is carried out firstly. Then the stress cycle method of the stress reliability test is studied according to the airborne environment spectrum. The reliability test is carried out after the test stress cycle is determined which accelerates the deterioration. The experimental results are analyzed for the study of the failure mechanism. The reliability test process in this paper provides a reference for the follow-up reliability test research, which has great significance to the development of installed chip components.