Real time process monitoring using diffraction-based overlay measurements from YieldStar
- Resource Type
- Conference
- Authors
- Chen, Henry; Chang, Jimmy; Tsao, Sheng-Tsung; Zhang, Junjun; Du, Jie; Fan, Congcong; Huang, Alex; Xu, David; Liu, Sam; Wu, Liang; Yang, Kimi; Gu, Ning; Ren, Liping; Wu, Jian; Tan, Alexander; Xia, Sunny; Mao, Ivan
- Source
- 2020 International Workshop on Advanced Patterning Solutions (IWAPS) Advanced Patterning Solutions (IWAPS), 2020 International Workshop on. :1-4 Nov, 2020
- Subject
- Components, Circuits, Devices and Systems
Computing and Processing
Engineered Materials, Dielectrics and Plasmas
Engineering Profession
Photonics and Electrooptics
Semiconductor device modeling
Process monitoring
Semiconductor device measurement
Predictive models
Real-time systems
Manufacturing
Velocity measurement
process monitoring
diffraction-based overlay
YieldStar
machine learning
- Language
Real-time process monitoring (RTPM) is a method for semiconductor manufacturing monitoring and tuning using a physical prediction model. It is a fast and nondestructive process excursion measurement method which takes inputs from diffraction-based overlay measurements from YieldStar. The prediction model is created by a physical model which receives standard manufacturing information as input. The prediction capability has been validated in a manufacturing environment experiment with thin film thickness prediction difference less than 3%.