Signal Integrity Improvement on High-Speed Packaging Routing by Enhanced T Stub
- Resource Type
- Conference
- Authors
- Kung, Ming-Lung; Lin, Yen-Chung; Cheng, Hung-Hsiang; Chen, Ting-Rui; Tien, Yun-Hsiang; Ding, Yi-Chuan; Lin, Ken-Huang
- Source
- 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2020 15th International. :270-272 Oct, 2020
- Subject
- Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Computing and Processing
Engineering Profession
Robotics and Control Systems
Crosstalk
Packaging
Power transmission lines
Impedance
Microstrip
Layout
Routing
- Language
- ISSN
- 2150-5942
In this paper, T stub is adopted in the microstrip lines of the high-speed packaging to reduce the crosstalk. The impedance matching is also improved by using the enhanced core via with optimized surrounding ground vias. The simulation results show the lower far-end crosstalk and better impedance matching design are achieved. The signal integrity of the high-speed packaging has been improved and verified by the eye-diagram performance in the experiments.