Synthesis of triangular silver nanoflakes and its application in die-attachment materials
- Resource Type
- Conference
- Authors
- Wang, Chuncheng; Li, Gang; Zhang, Dailin; Zhu, Pengli
- Source
- 2020 21st International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2020 21st International Conference on. :1-4 Aug, 2020
- Subject
- Components, Circuits, Devices and Systems
Fields, Waves and Electromagnetics
Photonics and Electrooptics
Signal Processing and Analysis
Silver
Bonding
Solvents
Nanoparticles
Scanning electron microscopy
Surface cracks
Chemicals
Nanoflake
Die-attach materials
Shear strength
- Language
Silver die-attachment materials have attracted much attention in power modules for high temperature environment and high current density. Nowadays, most of the silver flakes are obtained by ball milling, which is energy consuming and expensive. To avoid the process of ball milling, we synthesize silver nano-flakes in one step by chemical method. The shear strength of sintered bonding joints can reach 49.8MPa at a low temperature 300 °C. SEM and ion milling polishing characterizations were conducted to analyze the sinteringprocess of regular silver flakes. The results indicated that silver flakes are prone to sinter at low temperature and a higher temperature tend to induce a higher sintering density.