High Temperature Deformation Field Measurement Using 3D Digital Image Correlation Method
- Resource Type
- Conference
- Authors
- Deng, Hongtao; Jiang, Dong; Wang, Kai; Fei, Qingguo
- Source
- 2020 IEEE 5th International Conference on Image, Vision and Computing (ICIVC) Image, Vision and Computing (ICIVC), 2020 IEEE 5th International Conference on. :188-192 Jul, 2020
- Subject
- Computing and Processing
Temperature measurement
Strain
Cameras
Band-pass filters
Temperature
Digital images
Correlation
binocular vision
3D digital image correlation
deformation field measurement
high temperature
- Language
A full-field, three-dimensional and non-contact deformation field measurement method under high temperature environment based on 3D digital image correlation (3D-DIC) is introduced. In order to reduce the impact of high temperature radiation on the image quality, a band-pass filter is placed in front of the camera lens. The two cameras simultaneously take pictures of the object before and after deformation, and use 3D-DIC to measure the three-dimensional deformation field of the object surface. The high temperature deformation field measurement test shows that 3D-DIC can accurately and conveniently measure the deformation field of an object under high temperature environment.