Simulation and Experimental Validations of EM/TM/SM Physical Reliability for Interconnects Utilized in Stretchable and Foldable Electronics
- Resource Type
- Conference
- Authors
- Lee, Chang-Chun; Chuang, Oscar; Hsieh, Chia-Ping; Cheng, Wei-Yuan; Chiu, Steve
- Source
- 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :2009-2015 May, 2019
- Subject
- Components, Circuits, Devices and Systems
Stress
Predictive models
Current density
Soldering
Reliability
Geometry
Packaging
Interconnects
Flexible electrics
Electromigration
Redistribution layers
- Language
- ISSN
- 2377-5726
There are many portable electronic products made by fan-out wafer/panel level package (FOWLP/FOPLP). The redistribution layer(RDL) design with fine pitch to connect inter each application is used. However, the above packaging products usually face the issue of electromigration (EM). Hence, a finite-element-based simulation method to predict the EM/ thermomigration (TM)/ stressmigration (SM) physical reliability and experimental validation are proposed. In this research, the EM simulation method also considers other physical behaviors including stress and temperature effects for future applications such as stretchable and foldable electric products.