An Advanced CuCu Hybrid Bonding For Novel Stacked CMOS Image Sensor
- Resource Type
- Conference
- Authors
- Kagawa, Y.; Fujii, N.; Aoyagi, K.; Kobayashi, Y.; Nishi, S.; Todaka, N.; Takeshita, S.; Taura, J.; Takahashi, H.; Nishimura, Y.; Tatani, K.; Kawamura, M.; Nakayama, H.; Ohno, K.; Iwamoto, H.; Kadomura, S.; Hirayama, T.
- Source
- 2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM) Electron Devices Technology and Manufacturing Conference (EDTM), 2018 IEEE 2nd. :65-67 Mar, 2018
- Subject
- Bioengineering
Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Computing and Processing
Engineered Materials, Dielectrics and Plasmas
Engineering Profession
Power, Energy and Industry Applications
Signal Processing and Analysis
Bonding
CMOS image sensors
Through-silicon vias
Three-dimensional displays
Robustness
- Language
We have successfully mass-produced novel stacked back-illuminated CMOS image sensors (BI-CIS). In the new CIS, we introduced advanced CuCu hybrid bonding that we had developed. The electrical test results showed that our highly robust CuCu hybrid bonding achieved remarkable connectivity and reliability.