Cycle-accelerated simulation for three-dimensional near-data processing system with power, temperature, and latency analysis
- Resource Type
- Conference
- Authors
- Lin, Shu-Yen; Lin, Jin-Yi; Lin, Cheng-Hung
- Source
- 2018 IEEE International Conference on Applied System Invention (ICASI) Applied System Invention (ICASI), 2018 IEEE International Conference on. :124-126 Apr, 2018
- Subject
- Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Engineering Profession
Photonics and Electrooptics
Robotics and Control Systems
Signal Processing and Analysis
Three-dimensional displays
Computer architecture
Solid modeling
Random access memory
Computational modeling
Integrated circuit modeling
Analytical models
NDP
Big data
Memory
3D IC
- Language
In this work, we propose a cycle-accelerated simulation for 3D NDP system with power, temperature, and latency. Three cases for the different architectures of the 3D NDP system are simulated by using the proposed cycle-accelerated simulation.