Fabrication challenge, device characterization of high-Q 2D, 3D passives devices on glass
- Resource Type
- Conference
- Authors
- Hsieh, Sheng-Chi; Chen, Chien-Hua; Chang, Yung-Shun; Lee, Teck Chong; Lee, Pao-Nan; Wang, Chen-Chao; Chou, Yuan-Hsi
- Source
- 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Electrical Design of Advanced Packaging and Systems (EDAPS), 2016 IEEE. :75-77 2016
- Subject
- Communication, Networking and Broadcast Technologies
Fields, Waves and Electromagnetics
Signal Processing and Analysis
Glass
Transmission line measurements
Inductors
Harmonic analysis
Three-dimensional displays
Power harmonic filters
Q-factor
3D
IPD
SiP
glass wafer
inductor
- Language
- ISSN
- 2151-1233
It is demonstrated that the high quality factor of thick metal spiral inductors, 3D solenoid inductor and low harmonics power level can be achieved by using a mature glass substrate technology. The quality factor of inductors in a 2D/3D type can achieve 70∼100 in this study. The harmonics power level is measured along transmission line and 2nd /3rd harmonics can be below −110 dBm at 30 dBm input power. It is very critical and helpful with high Q-factor and lower harmonics power level for the FEM development of current and next generation's commercial 4G carrier aggregation system.