Fabrication challenge, device characterization and modeling of 4G passives on glass and silicon
- Resource Type
- Conference
- Authors
- Hsieh, Sheng-Chi; Kung, Cheng-Yuan; Lee, Teck Chong; Wang, Chen-Chao; Chen, Chi-Han
- Source
- 2016 6th Electronic System-Integration Technology Conference (ESTC) Electronic System-Integration Technology Conference (ESTC), 2016 6th. :1-5 Sep, 2016
- Subject
- Components, Circuits, Devices and Systems
Glass
Silicon
Conductivity
Power harmonic filters
Transmission line measurements
Harmonic analysis
Substrates
- Language
It is demonstrated that the high quality factor of thick metal spiral inductors and passive circuits with low induced harmonics power level can be achieved by using a mature glass substrate technology. It is very critical and helpful with lower harmonic power level for the FEM development of current and next generation's commercial 4G carrier aggregation system.