Transient thermal imaging characterization of a die attached optoelectronic device on silicon
- Resource Type
- Conference
- Authors
- Yazawa, Kazuaki; Kendig, Dustin; Al-hemyari, Kadhair; Shakouri, Ali
- Source
- Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on. :1308-1312 May, 2014
- Subject
- Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
General Topics for Engineers
Photonics and Electrooptics
Power, Energy and Industry Applications
Thermal resistance
Silicon
Substrates
Passivation
Heat sinks
Transient analysis
time response
thermal imaging
passivation layer
thermal resistance
optoelectronics
- Language
- ISSN
- 1087-9870
Packaging of optoelectronic devices becomes more and more challenging due to higher heat generation per unit volume. We experimentally investigated the packaging thermal resistance for a semiconductor laser device and compared results for two material alternatives for the electrical passivation layer. We used the time-resolved thermoreflectance technique to obtain the time response for the thermal diffusion.