Study of EMC for Cu bonding wire application
- Resource Type
- Conference
- Authors
- Maeda, Masakatsu; Seki, Hidetoshi
- Source
- 2013 14th International Conference on Electronic Packaging Technology Electronic Packaging Technology (ICEPT), 2013 14th International Conference on. :393-395 Aug, 2013
- Subject
- Components, Circuits, Devices and Systems
Wires
Electromagnetic compatibility
Bonding
Corrosion
Gold
Materials
Cu wire
affect of pH value toward HAST performance
inter-metaric layer between Cu and Al pad
- Language
The influence of EMC (Epoxy Molding Compound) and reliability with fine Cu wire was studied. It is found that the failure mode was corrosion at the intermetallic layer of the wire bonding part by failure analysis after HAST (Highly Accelerated Temperature & Humidity Stress Test). Al elution and Cl ion was observed at the intermetallic layer. EMC with lower Cl ion content and Al inhibitor of corrosion shows better HAST property. The selection of flame retardant for green EMC is important because some retardant has a negative impact on HAST performance.