In situ heating to improve adhesion for parylene-on-parylene deposition
- Resource Type
- Conference
- Authors
- Kang, Dongyang; Chang, Jay Han-Chieh; Kim, Justin Young-Hyun; Tai, Yu-Chong
- Source
- 2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) Nano/Micro Engineered and Molecular Systems (NEMS), 2012 7th IEEE International Conference on. :226-229 Mar, 2012
- Subject
- Components, Circuits, Devices and Systems
Computing and Processing
Bioengineering
Communication, Networking and Broadcast Technologies
Signal Processing and Analysis
Substrates
Polymers
Heating
Nanoelectromechanical systems
Switches
in-situ heating
PA-C substrate
adhesion
undercut
- Language
A new technique of using “in-situ heating” to enhance adhesion for parylene-on-parylene deposition is reported. This method is compared with existing physical or chemical adhesion-enhancing methods and the results show clear advantages of this new technique. The physics is believed to be that the mobility of deposition-involved molecules (including the substrate parylene polymer chains and adsorbed monomers during deposition) is enhanced when deposition temperature rises, especially above the glass transition temperature of the substrate parylene. Each sample is patterned and then soaked in 0.9% saline at 90°C, and the undercut between two parylene layers due to the attack from saline during the soaking test could be observed. The undercut rate is measured to quantify the adhesion strength.