High resolution analysis of self assembled Cu nanowires on vicinal Si(001)
- Resource Type
- Conference
- Authors
- Ng, Poh-Keong; Fisher, Brandon; Low, Ke-Bin; Joshi-Imre, Alexandra; Bode, Matthias; Lilley, Carmen M.
- Source
- 2011 11th IEEE International Conference on Nanotechnology Nanotechnology (IEEE-NANO), 2011 11th IEEE Conference on. :1114-1117 Aug, 2011
- Subject
- Components, Circuits, Devices and Systems
Computing and Processing
Nanowires
Copper
Silicon
Self-assembly
Substrates
Wires
Self assembly
Cu nanowires
TEM
FIB
diffraction pattern
- Language
- ISSN
- 1944-9399
This paper presents material properties of self-assembled Cu nanowires that were fabricated in the vacuum e-beam evaporation method. Diffraction patterns obtained from the Transmission Electron Microscopy (TEM) indicate that the Cu nanowires have two slightly different properties: single crystalline structures and polycrystalline structures with low angle grain boundary. Focused ion beam (FIB) was also used to observe the nanowires cross sectional shape.