Package level integration of a monolithic buck converter power IC and bondwire magnetics
- Resource Type
- Conference
- Authors
- Jia, Hongwei; Lu, Jian; Wang, Xuexin; Padmanabhan, Karthik; Shea, Patrick; Shen, Z. John
- Source
- 2010 22nd International Symposium on Power Semiconductor Devices & IC's (ISPSD) Power Semiconductor Devices & IC's (ISPSD), 2010 22nd International Symposium on. :51-54 Jun, 2010
- Subject
- Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Power, Energy and Industry Applications
Integrated circuit packaging
Buck converters
Power integrated circuits
Bonding
Inductors
Prototypes
CMOS process
Ferrites
Magnetic cores
Active filters
- Language
- ISSN
- 1063-6854
1946-0201
1943-653X
In this paper, we report a concept of integrating a monolithic buck converter power IC with in-package bondwire inductors. The power IC was designed and fabricated with a standard 0.5µm CMOS process. Multi-turn bondwires with and without ferrite epoxy glob cores are used as the filter inductor in the buck converter. A 2.5V/120mA prototype system in package (SiP) buck converter is built to operate at frequencies up to 5MHz. The power level of the prototype buck converter is scalable by increasing the size of the active power switches.