Development of Glass-Substrate-Based MEMS Micro-Hotplate with Low-Power Consumption and TGV Structure Through Anodic Bonding and Glass Thermal Reflow
- Resource Type
- Conference
- Authors
- Qian, Honglin; Dai, Haotian; Chen, Fanhong; Liu, Shuai; Du, Xiaohui; Li, Bing; Zhu, Minjie; Xue, Gaopeng
- Source
- 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS) Micro Electro Mechanical Systems (MEMS), 2024 IEEE 37th International Conference on. :891-894 Jan, 2024
- Subject
- Bioengineering
Components, Circuits, Devices and Systems
Fields, Waves and Electromagnetics
Photonics and Electrooptics
Power, Energy and Industry Applications
Power demand
Microfabrication
Glass
Conductivity
Thermal conductivity
Bonding
Three-dimensional integrated circuits
Anodic bonding
glass thermal reflow
glass-based micro-hotplate
low power consumption
TGV
- Language
- ISSN
- 2160-1968
This study innovatively proposed a microfabrication method of anodic bonding and glass thermal reflow for fabricating glass-based MEMS micro-hotplates with (through glass via) TGV structure. Compared with the conventionally adopted Si-based micro-hotplate, the glass-based micro-hotplate with smaller thermal conductivity coefficient (1.4 W/(m*K)) leads to a lower power consumption. The glass-based micro-hotplate with insulation characteristic can directly support the micro-heater electrodes, and the conductive Si columns in TGV can replace the wire-bonder to realize the electrical interconnection with Integrated Circuit (IC). Finally, the fabricated glass-based micro-hotplates (0.196 mm 2 ) can achieve a low power consumption of 80.4 mW at the target temperature of 305°C.