High-Speed Embedded Memory for AI and High-Performance Compute
- Resource Type
- Conference
- Source
- 2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023
- Subject
Bioengineering Communication, Networking and Broadcast Technologies Components, Circuits, Devices and Systems Computing and Processing Engineered Materials, Dielectrics and Plasmas Fields, Waves and Electromagnetics Nuclear Engineering Photonics and Electrooptics Power, Energy and Industry Applications Robotics and Control Systems Signal Processing and Analysis Technological innovation Microprocessors Memory management Cache memory Random access memory Voltage Energy efficiency - Language
- ISSN
- 2156-017X