Since the Meta, Amazon, Google and Microsoft are the popular social media and search website related with our daily life, the artificial intelligence (AI) with cloud computing become one of the most important for semiconductor industry. The cloud computing, high performance computing and artificial intelligence solutions require big data analysis processing with faster connections than ever, and all of these will need to have advanced technology supporting. The rise in energy costs and the increasing demand for sustainability to reduce environmental impacts further increase people's desire for high performance and high efficiency computing. The complex dataset has been tremendously grown on commercial application and widespread adoption of deep learning and neural networks. The advanced Node with System on Chip (SoC) chip size extension may the simplest design solution for good electrical performance, but the low yield rate cause of very expensive cost. The split die integration in package is the best solution to increase gross die with wafer good yield rate for cost effective [1]. Please see the Figure 1. The advantage of Chiplet The demand for higher functionality devices drive integration technologies to overcome limitations in Moore's Law and the Fan Out Multi Chip Module (FO-MCM) package can take the role for Cloud Computing to Edge Computing. Please see the Figure 2. FO-MCM Package. Today, the consumer product always requests not only thiner and power stamina but also high speed and massive connectivity for data transmission. The FO-MCM package can do the homogeneous integration and heterogeneous integration for each of different application because the cloud computing and Edge computing need to met the high performance and good electronic performance design requirement. That is the reason FO-MCM package solution can be the representative for homogeneous integration and heterogeneous integration. In this paper, we would like to discuss what the advantage for FO-MCM package and why this package can be used for different applications. The package will demonstrate the homogeneous integration package and heterogeneous integration package solutions for Edge and Cloud computing applications.