Study of Coplanar Waveguide Wire Bonding Interconnection on MMIC
- Resource Type
- Conference
- Authors
- Cui, Guangyan; Yuan, Wenze; Cui, Xiaohai; Liu, Xiaomeng; Liu, Jinwen; Ding, Sheng
- Source
- 2023 International Conference on Microwave and Millimeter Wave Technology (ICMMT) Microwave and Millimeter Wave Technology (ICMMT), 2023 International Conference on. :1-3 May, 2023
- Subject
- Components, Circuits, Devices and Systems
Computing and Processing
Engineered Materials, Dielectrics and Plasmas
Fields, Waves and Electromagnetics
Signal Processing and Analysis
Waveguide transitions
Microwave measurement
Simulation
Wires
Microwave circuits
Loss measurement
Coplanar waveguides
Wire bonding
Equivalent circuit
Coplanar waveguide
Package
- Language
The packaging of monolithic microwave integrated circuit is one of its most important tasks before application. The model and equivalent circuit of gold wire is established. Full wave simulation is used to determine the effect on return loss with different wire parameters between coplanar waveguide. The optimized parameters are used in bonding process and an actual circuit’s return loss is measured by a vector network analyzer. Compare the measurement result with the simulation result, there is a same trend from 1GHz to 18GHz, and the return loss is lower than -17dB from 1GHz to 10GHz.