Packaging of 20 kV Double-Side Cooled Silicon Carbide Diode Module With Electrical Insulation Enhanced by a Polymer-Nanoparticle Coating
- Resource Type
- Conference
- Source
- 2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe) Power Electronics and Applications (EPE'23 ECCE Europe), 2023 25th European Conference on. :P.1-P.6 Sep, 2023
- Subject
Aerospace Components, Circuits, Devices and Systems Power, Energy and Industry Applications Robotics and Control Systems Transportation Partial discharges Insulation Inductance Silicon carbide Thermal resistance Packaging Electronic packaging thermal management «Packaging» «Partial discharge» «Silicon Carbide» «Thermal management» «Medium voltage» - Language