Analysis of Mesh Ground Impact on Microstrip Lines in Flexible Printed Circuits
- Resource Type
- Conference
- Authors
- He, Yuchu; Wang, Hanfeng
- Source
- 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), 2023 IEEE Symposium on. :286-290 Jul, 2023
- Subject
- Fields, Waves and Electromagnetics
Flexible printed circuits
Systematics
Microstrip
Impedance
Characteristic impedance
meshed ground plane
transmission line
flexible printed circuits
- Language
Meshed ground (GND) planes are widely used in flexible printed circuit boards to reduce weight and increase flexibility. However, analyzing the impact from the meshed GND in a transmission line structure can be challenging. In this paper, an extraction method is proposed to obtain the characteristic impedance of a transmission line over the meshed GND planes. With the proposed method, a systematic study was carried out to investigate the relationship between the meshed GND plane geometric parameters and the trace characteristics.