Reliability Modeling of Middle-Of-Line Interconnect Dielectrics in Advanced process nodes
- Resource Type
- Conference
- Authors
- Kasim, R.; Lin, C.; Perini, C.; Palmer, J.; Gilda, N.; Imam, S.; Weber, J. R.; Wallace, C.; Hicks, J.
- Source
- 2023 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2023 IEEE International. :1-8 Mar, 2023
- Subject
- Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Engineering Profession
Systematics
Sociology
Process control
Tail
Aerospace electronics
Dielectrics
Dielectric breakdown
component
Interconnect dielectric Reliability
Middle of Line Reliability
low-k reliability
low-k TDDB
- Language
- ISSN
- 1938-1891
This paper discusses the physics and methodology for estimating the Reliability lifetime of MOL (Middle-Of-Line) dielectrics for advanced process nodes. Both intrinsic and defect reliability aspects of MOL dielectrics are investigated for accurate projection of Reliability lifetime on Intel 4 process technology. Methods to deconvolute the impact of process driven variations on intrinsic Time Dependent Dielectric Breakdown (TDDB) are presented. In addition, a new construct for targeting of the MOL process parameters is also proposed to address challenges with technology scaling and to mitigate risk with pattern fidelity driven variations.