This work presents an embedded matching scheme on the multilayer print circuit board (PCB) for film bulk acoustic resonator (FBAR) filters with wafer-level chip-scale package (WL-CSP), which are widely used in front-end modules (FEMs) for mobile communication. The matching inductors connected in parallel to ground with different inductance are designed and integrated into the middle layer of PCB. For the S-band WL-CSP FBAR filter, the simulation and measurement results show that the matching inductance of 7 nH can achieve a good in-band and out-of-band response. According to the test results, the insertion loss is 2.3 dB and the return loss is -16.4 dB at the working center frequency of 2069 MHz, while the out-of-band rejection is more than 40 dB. The embedded matching inductor of 7 nH has a compact size of ~2 mm 2 . This technique has the characteristics of miniaturization, high flexibility and easy integration, which realizes the performance optimization of the WL-CSP FBAR filter.