Extraction and Compensation of Bonding Wires Parasitic Parameter
- Resource Type
- Conference
- Authors
- Cui, Guangyan; Yuan, Wenze; Liu, Jinwen; Cui, Xiaohai; Liu, Xiaomeng
- Source
- 2022 Cross Strait Radio Science & Wireless Technology Conference (CSRSWTC) Cross Strait Radio Science & Wireless Technology Conference (CSRSWTC), 2022. :1-3 Dec, 2022
- Subject
- Computing and Processing
Fields, Waves and Electromagnetics
Photonics and Electrooptics
Signal Processing and Analysis
Waveguide transitions
Inductance
Transmission line matrix methods
Wires
Low-pass filters
Transmission line measurements
Loss measurement
bongding wires
coplanar waveguide
parasitic effect
capacity compensation
- Language
- ISSN
- 2377-8512
The inherent parasitic parameters of bonding wires result in impedance mismatch in integrated microwave system. The equivalent circuit of bonding wire is modeled by $\pi$ -type lossless network, and further described by an admittance matrix. The parasitic parameters of multiple bonding wires are extracted by simulation. For impedance matching, a third-order Chebyshev filter section is designed to compensate the parasitic parameters. The section is applied on transition coplanar waveguide transmission line, connected to the MMIC. Results show a significantly reduction of return loss with compensation section applied. Return loss is reduced by 15dB in simulation and 10dB in measurement at 18GHz.