RF Interconnection Design of Bump Bonding with a Dislocation Package Structure towards Electro-Optic Modulation Applications.
- Resource Type
- Article
- Source
- Photonics; Dec2023, Vol. 10 Issue 12, p1348, 12p
- Subject
DISLOCATION structure SEALING (Technology) OPTICAL modulation PACKAGING design RADIO frequency - Language
- ISSN
- 23046732