Bottom-Up Cu Filling of High-Aspect-Ratio through-Diamond vias for 3D Integration in Thermal Management.
- Resource Type
- Article
- Source
- Micromachines; Feb2023, Vol. 14 Issue 2, p290, 11p
- Subject
COPPER HEAT storage DIAMOND surfaces OXYGEN plasmas SEMICONDUCTOR devices POWER density DIAMONDS DIAMOND crystals - Language
- ISSN
- 2072666X