The CORE Sequence: A Nanoscale Fluorocarbon-Free Silicon Plasma Etch Process Based on SF6 /O2 Cycles with Excellent 3D Profile Control at Room Temperature.
- Resource Type
- Article
- Source
- ECS Journal of Solid State Science & Technology; 2020, Vol. 9 Issue 2, p1-13, 13p
- Subject
- Language
- ISSN
- 21628769