Enhancement of Mechanical Bending Stress Endurance Using an Organic Trench Structure in Foldable Polycrystalline Silicon TFTs.
- Resource Type
- Article
- Source
- IEEE Electron Device Letters; May2020, Vol. 41 Issue 5, p721-724, 4p
- Subject
BENDING stresses POLYCRYSTALLINE silicon THIN film transistors TRENCHES YOUNG'S modulus BUFFER layers - Language
- ISSN
- 07413106