microelectronics reliability (64)
optical materials (10)
eurosime 2006 - 7th international conference on thermal, mechanical & multiphysics simulation & experiments in micro-electronics & micro-systems (8)
eurosime 2006 - 7th international conference on thermal, mechanical and multiphysics simulation and experiments in micro-electronics and micro-systems, thermal, mechanical and multiphysics simulation and experiments in micro-electronics and micro-systems, 2006. eurosime 2006. 7th international conference on (8)
eurosime 2008 - international conference on thermal, mechanical & multi-physics simulation & experiments in microelectronics & micro-systems (8)
2007 international conference on thermal, mechanical & multi-physics simulation experiments in microelectronics & micro-systems. eurosime 2007 (7)
5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, 2004. eurosime 2004. proceedings of the, thermal and mechanical simulation and experiments in microelectronics and microsystems, 2004. eurosime 2004. proceedings of the 5th international conference on, eurosime 2004 (7)
proceedings of the 5th international conference on thermal & mechanical simulation & experiments in microelectronics & microsystems, 2004. eurosime 2004 (7)
2005 6th international conference on electronic packaging technology (5)
2005 6th international conference on electronic packaging technology, electronic packaging technology, 2005 6th international conference on, electronics packaging technology (5)
2006 7th international conference on electronic packaging technology (5)
2008 58th electronic components & technology conference (5)
2008 58th electronic components and technology conference, electronic components and technology conference, 2008. ectc 2008. 58th (5)
2010 11th international conference on thermal, mechanical & multi-physics simulation & experiments in microelectronics & microsystems (eurosime) (5)
2011 12th international conference on thermal, mechanical & multi-physics simulation & experiments in microelectronics & microsystems (eurosime) (5)
2006 7th international conference on electronic packaging technology, electronic packaging technology, 2006. icept '06. 7th international conference on (4)
2007 international conference on thermal, mechanical and multi-physics simulation experiments in microelectronics and micro-systems. eurosime 2007 (4)
2007 international conference on thermal, mechanical and multi-physics simulation experiments in microelectronics and micro-systems. eurosime 2007, thermal, mechanical and multi-physics simulation experiments in microelectronics and micro-systems, 2007. eurosime 2007. international conference on (4)
eurosime 2005. proceedings of the 6th international conference on thermal, mechanial and multi-physics simulation and experiments in micro-electronics and micro-systems, 2005., thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems, 2005. eurosime 2005. proceedings of the 6th international conference on, thermal mechanical and multi-physics simulation and experiments in micro-electronics and micro-syste (4)
eurosime 2005. proceedings of the 6th international conference on thermal, mechanical & multi-physics simulation & experiments in micro-electronics & micro-systems, 2005 (4)
eurosime 2009 - 10th international conference on thermal, mechanical & multi-physics simulation & experiments in microelectronics & microsystems (4)
2007 8th international conference on electronic packaging technology (3)
2007 proceedings 57th electronic components & technology conference (3)
2010 11th international thermal, mechanical & multi-physics simulation, and experiments in microelectronics and microsystems (eurosime), thermal, mechanical & multi-physics simulation, and experiments in microelectronics and microsystems (eurosime), 2010 11th international conference on (3)
2011 12th intl. conf. on thermal, mechanical & multi-physics simulation and experiments in microelectronics and microsystems, thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2011 12th international conference on (3)
2014 15th international conference on thermal, mechanical & multi-physics simulation & experiments in microelectronics & microsystems (eurosime) (3)
2014 15th international conference on thermal, mechanical and mulit-physics simulation and experiments in microelectronics and microsystems (eurosime), thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014 15th international conference on (3)
2015 16th international conference on thermal, mechanical & multi-physics simulation & experiments in microelectronics & microsystems (3)
2015 16th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems, thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2015 16th international conference on (3)
eurosime 2009 - 10th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems, thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems, 2009. eurosime 2009. 10th international conference on (3)
ieee access, access, ieee (3)
2007 8th international conference on electronic packaging technology, electronic packaging technology, 2007. icept 2007. 8th international conference on (2)
2007 proceedings 57th electronic components and technology conference, electronic components and technology conference, 2007. ectc '07. proceedings. 57th (2)
2009 international conference on electronic packaging technology & high density packaging (2)
2010 11th international conference on electronic packaging technology & high density packaging (icept-hdp) (2)
2010 11th international conference on electronic packaging technology & high density packaging, electronic packaging technology & high density packaging (icept-hdp), 2010 11th international conference on (2)
2017 18th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2017 18th international conference on (2)
56th electronic components & technology conference 2006 (2)
56th electronic components and technology conference 2006, electronic components and technology conference, 2006. proceedings. 56th, electronic components & technology (2)
computational materials science (2)
ieee transactions on components and packaging technologies, components and packaging technologies, ieee transactions on, ieee trans. comp. packag. technol. (2)
journal of electronic materials (2)
materials letters (2)
11th electronics packaging technology conference, 2009. eptc '09 (1)
2004 proceedings 54th electronic components & technology conference (ieee cat. no.04ch37546) (1)
2004 proceedings. 54th electronic components and technology conference (ieee cat. no.04ch37546), electronic components and technology conference, 2004. proceedings. 54th, electronic components and technology (1)
2007 9th electronics packaging technology conference (1)
2007 9th electronics packaging technology conference, electronics packaging technology conference, 2007. eptc 2007. 9th (1)
2008 3rd international microsystems, packaging, assembly & circuits technology conference (1)
journal of materials science & technology (1)