DTIP2017, Design, Test, Integration & Packaging of MEMS/MOEMS DTIP2017, Design, Test, Integration & Packaging of MEMS/MOEMS, May 2017, Bordeaux, France
Japanese Journal of Applied Physics Japanese Journal of Applied Physics, Japan Society of Applied Physics, 2016, 55 (4S), pp.04EF14. ⟨10.7567/JJAP.55.04EF14⟩