Bonding between the micro-LED chip and the substrate soldered joint has become a key bottleneck after the mass transfer process of moving individual chips regarded as the biggest technical obstacle for the commercialization of display. A new laser-assisted bonding process of pure metallic Au/Sn with high productivity and low cost is applied in 62 × 78 pixels full-color micro-LED display. Au–Sn solder alloy has high yield strength, corrosion and creep resistance, good wetting behavior, as well as good thermal/electrical conductivity [1]. Low-temperature solid liquid bonding method below 280 °C to achieve reliable metal electrical connection between microscale LED devices and the backplane is achieved firstly, to ensure the drive backplane operation well. The micro-morphology and formation mechanism of different alloy phase compositions of metal elements have been thoroughly analyzed, and a feasible technological route has been developed for the upcoming mass production of micro-LED display modules.