Laser-induced Deposition Method for Mask-less Copper Patterning on the Glass Substrate
- Resource Type
- Academic Journal
- Authors
- 이용훈 (Yonghoon Lee); 이황규 (Hwanggyu Lee); 김동민 (Dong Min Kim); 김태욱 (Taewook Kim); 김지수 (Jisoo Kim)
- Source
- Journal of the Korean Society for Precision Engineering. 2023-12 40(12):965-973
- Subject
- Laser induced deposition (레이저 기반 증착 공정)
Mask-less copper pattern (마스크 없는 구리 패턴)
Laser induced plasma backward deposition (레이저 기반 플라스마 유도 역방향 증착)
- Language
- Korean
- ISSN
- 1225-9071
2287-8769
This study investigated the Laser-Induced Plasma Backward Deposition (LIPBD) process for transparent glass-copper composite film production. LIPBD was compared with Laser-Induced Backward Transfer (LIBT). Controlling laser parameters and the z-axis position of Depth of focus (DOF) resulted in various post-deposition outcomes. The optimal deposition depth was 10 μm to 90 μm, ensuring good glass-copper adhesion. Scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS) mapping confirmed copper and copper oxide (CuO) particles. X-ray diffraction confirmed Cu and CuO peaks. The adhesive test showed a strong binding between glass and deposition, but the parts of the cracks caused by heat accumulation were delaminated during the test. LIPBD offers controlled deposition potential for glass-copper composites. Optimizing laser parameters leads to high-quality films. This study provides valuable insights into nanotechnology and the semiconductor industry, with potential applications across diverse fields.