A multi layer encapsulating film includes at least one planarizing organic thin film, at least one conformal organic thin film, and at least one inorganic thin film. The thin films are laminated in order of (a) a planarizing organic thin film, an inorganic thin film, a conformal organic thin film, and an inorganic thin film, (b) a conformal organic thin film, an inorganic thin film, a planarizing organic thin film, and an inorganic thin film, (c) a planarizing organic thin film, a conformal organic thin film, and an inorganic thin film, or (d) a conformal organic thin film, a planarizing organic thin film, and an inorganic thin film. The multi layer encapsulating film according to the invention can improve the surface roughness by using the planarizing organic thin film, and can enable particles to uniformly cover the device by using the conformal organic thin film.