A method for inspecting array substrates, which includes a first array substrate having first pads and first electrodes, and a second array substrate having second pads and second electrodes, the method comprising connecting the first pads to terminals formed an array of inspection pad groups and disposed in a predetermined arrangement, bringing probes with an arrangement corresponding to the predetermined arrangement into contact with the terminals, and supplying electric power to the first electrodes via the probes, thereby inspecting whether the first electrodes of the first array substrate is defective or not, and connecting the second pad to the terminals, bringing the probes, without changing the arrangement thereof, into contact with the terminals, and supplying electric power to the second electrodes via the probes, thereby inspecting whether the second electrodes of the second array substrate is defective or not.