A method and apparatus for fabricating one or more electronic devices from wafer, die or other holder including designing a plurality of electronic devices (805), wherein each of the electronic devices is encapsulated in a cell and designing a plurality of tethers (825). Each tether includes a first end and a second end. The method includes selecting an attachment point (835, 860) on each of the plurality of electronic devices, attaching the first end of each of the plurality of tethers to one of the attachment points, selecting a plurality of anchor points (835, 860), attaching the second end of each of the plurality of tethers to one of the anchor points. The method includes determining a fracture condition (835) for each electronic device that breaks the tether at the first end (865). The fracture condition is same for a group of electronic devices in the plurality of electronic devices.