Solder ball of initial diameter 1.4 mm, was refl ow soldered with Cu substrate at 523.15 K using fl ux doped with Cu@Agcore–shell nanoparticles (NPs) in the proportion 0–2 wt%. The solders were then air cooled to room temperature. The use ofNPs, by reducing the base height (H) of the solder and enhanced the diameter (W) of the solder, caused an overall increase inthe spread ratio of the solder. The altered magnitudes of heat and mass transfer in these geometrically diff erent but constantvolume specimens were analyzed using fi nite element method. The occurrence of diff erential concentration gradient, radialthermal gradient and velocity magnitudes, in solders with diff ering geometry were numerically elaborated. The Cu6Sn5 intermetalliccompound (IMC) formed at the Cu/Sn interface, was obtained to be the thickest for the specimen using undopedfl ux, whereas it was found to be smallest for the sample processed with fl ux containing 0.5% NPs. From the growth kineticsstudy, it has been inferred that IMC thickness is linearly proportional to the geometrical parameter H and Wb , with b < 1.
Solder ball of initial diameter 1.4 mm, was refl ow soldered with Cu substrate at 523.15 K using fl ux doped with Cu@Agcore–shell nanoparticles (NPs) in the proportion 0–2 wt%. The solders were then air cooled to room temperature. The use ofNPs, by reducing the base height (H) of the solder and enhanced the diameter (W) of the solder, caused an overall increase inthe spread ratio of the solder. The altered magnitudes of heat and mass transfer in these geometrically diff erent but constantvolume specimens were analyzed using fi nite element method. The occurrence of diff erential concentration gradient, radialthermal gradient and velocity magnitudes, in solders with diff ering geometry were numerically elaborated. The Cu6Sn5 intermetalliccompound (IMC) formed at the Cu/Sn interface, was obtained to be the thickest for the specimen using undopedfl ux, whereas it was found to be smallest for the sample processed with fl ux containing 0.5% NPs. From the growth kineticsstudy, it has been inferred that IMC thickness is linearly proportional to the geometrical parameter H and Wb , with b < 1.