Nanoscale particles are not new in either nature or science. However, the recent research in areas such as microscopy have given scientists new tools to understand and take advantage of phenomena that occur naturally when matter is organized at the nanoscale. Properties of the ultrafine particles are characterized by the components on their surfaces more so than larger structures, such as cells, due to large surface area-to-volume ratios. Large surface area-to-volume-ratios of nanoparticles optimize the potential for interactions. The small size, customized surface, improved solubility, and multi-functionality of nanoparticles will continue to open and create new applications. Indeed, the novel properties of nanoparticles offer the ability to interact with complex functions in new ways. And an aerosol is defined as collection of solid or liquid particles suspended in a gas. By the definition of aerosol it can be controlled with the kinetic interaction theory. The interaction between particles and gases are related with the temperature, pressure, mean free path, viscosity, diffusion of a gas and number per unit volume, mass diameter and velocity of a particles. Within a particles which is in high velocity of fluid are can be controlled with the fluid but because of differential of density of particles are used like a bullet in microscopic condition. Aerosol deposition is based on shock loading solidification due to the impact of fine ceramic particles with sub-micrometer in diameter, which are accelerated by carrier gas. There are several conventional ceramic film formation methods exist such as sintering and sputtering method. However, these processes need high sintering temperature or vacuum operating condition, which increases processing cost and make processing complicate. In this thesis, atmospheric aerosol spray method (AAS) was suggested to replace previous film formation methods. AAS is aerosol spray method which forms a film under atmospheric and low temperature conditions. It was assumed that a part of particle’s kinetic energy was converted into local thermal energy that promoted the bonding, because shock loading solidification due to the impact of fine ceramic particles. AAS method condition can be easily form compare with previews work because it doesn’t need to prepare the powder in high temperature and it can be operate atmospheric pressure. Also it can generate a highly functional film on a substrate using metal or non-metal powders. In this paper, we evaluated some of the important film properties such as porosity, adhesion force, surface roughness and insulation characteristics for deposited insulation films under various conditions. In addition, we observed that dense Al2O3 films can be deposited with suitable characteristics to be applied as an insulating layer with 15 μm thickness, relatively low surface roughness (< 500 nm), and high breakdown voltage (2 kV). These results imply that formed films by AAS method are adequate for thermoelectric material. Although in semiconductor area particulate contaminants play a main cause of lower yields in the fields that are required to an elaborate process. Because semiconductor (and electronic) devices become more highly integrated and their geometry continues to shrink. From that adherence of a few particles for electronic or semiconductor devices can bring critical damage to their performance. Aerosol cleaning can be applied to remove the adherence particles that works as residue on the surface. From that surface treatment by CO2 cluster cleaning is based on the impaction of aerosol. Cleaning performance are depend on the size of clusters that define the amount of momentum transfer. To control the cleaning process the size distribution of generating clusters is important. A function of several variables such as, flow rate, temperature, and etc. For that the CO2 cluster cleaning method was investigated both numerically and experimentally to figure out the size control method and size effect of CO2 clusters. First, the CO2 cluster generation phenomenon was observed by two experimental methods. One is trace of dent size on the photoresist film and another is size measurement through the particle beam mass spectrometer (PBMS). Overall analysis of these methods shows the trend of cluster formation by variables. And particle removal efficiency (PRE) are measured with the CeO2, SiO2 particles) with various size range (30, 50, 100, 300 nm) were used. And pattern damage tested by using poly-Si patterns (30 ~ 180 nm). Required cluster size to remove contaminants from the surface was calculated from the comparison between adhesion force and removal force. PRE in % were 95% PRE was selected as a critical PRE for 100 nm CeO2 and 50 nm SiO2. The critical sizes to remove 100 nm CeO2 and 50 nm SiO2 with 95% of removal efficiency were around 57 nm and 48 nm for each. As flow rate increases, generating clusters are going smaller with higher velocity Each application has their target size of aerosol. Cluster size that is enough to remove the contaminant of each application is controllable based on both results of numerical and experimental. To find the suitable application field for CO2 cluster cleaning, two targets were tested. Finally, suggestion of the removal model as a function of cluster size for each application is the goal of thesis.
유체 내에서 고속인 입자는 쉽게 유선을 따르지만, 동시에 입자 밀도의 차이로 인해 탄환처럼 사용할 수 있다. 이러한 특성일 이용해 에어로졸 증착법은 직경이 마이크로 미터 이하인 미세세라믹입자를 수송 가스에 의해 가속시켜 기판에 충돌 하여 응고되는 방법을 사용한다. 기존의 소결 및 스퍼터링 방법과 같은 몇 가지 통상적인 세라믹막 형성 방법이 존재하지만, 이들 공정은 높은 소결 온도 또는 진공 작동 조건을 필요로 하므로 공정 비용이 증가하고 공정이 복잡해진다. 이 논문에서, 대기 에어로졸 스프레이 방법 (AAS)은 이전의 필름 형성 방법을 대체하기 위해 제안하고 검증하였다. AAS는 대기 및 저온 조건에서 필름을 형성하는 에어로졸 스프레이 방법으로 분말을 고온에서 준비 할 필요가 없고 대기압으로 작동 할 수 있다는 장점이 있다. 이 논문에서는 다양한 조건에서 증착 된 절연 필름의 다공성, 접착력, 표면 거칠기 및 절연 특성과 같은 중요한 필름 특성 중 일부를 평가했습니다. 또한, 밀도가 높은 Al2O3 막이 15μm 두께, 비교적 낮은 표면 거칠기 (