In this report, we demonstrate that the thermal conductivity, glass transition temperature, thermal stabilityand dynamical mechanical properties of epoxy composites could all be improved by incorporating hyperbranchedaromatic polyamide grafted silicon carbide (SiC-HBP) whiskers, using a solution method. The morphology andthermal properties of these newly modified epoxy composites were systematically analyzed and studied. Fouriertransform infrared spectroscopy (FTIR), nuclear magnetic resonance spectroscopy (NMR), and thermal gravimetricanalyses (TGA) proved hyperbranched aromatic polyamide grafted SiC whiskers were successfully prepared bysolution polymerization. The thermal conductivity of epoxy composite with 30 wt% of SiC-HBP had 2-fold improvement,compared to that of the neat epoxy. Besides, the glass transition temperatures (Tg) and dynamical mechanicalproperties of the epoxy composites were also raised by the addition of SiC-HBP, which indicates strong interfacialadhesion between SiC-HBP and the epoxy matrix. Most importantly, the incorporation of SiC-HBP in the epoxymatrix could effectively improve the thermal stability of the epoxy composites, according to our thermogravimetricanalysis (TGA).