A four-layered W/Cu functionally graded material (FGM) (W90% þ Cu10%/W80% þ Cu20%/W70% þ Cu30%/W60% þ Cu40%, wt.% fraction) and a four-layered diamond/WeCu FGM (W90% þ Cu10%/W80% þ Cu20%/W70% þ Cu30%/W55% þ Cu40% þ diamond5%, wt.% fraction) were fabricated by microwavesintering. The thermal conductivity and thermal shock resistance of diamond/WeCu FGM andWeCu FGM were investigated. The morphologies of the diamond particles and different FGMs wereanalyzed using AFM, SEM, EDS, and TEM. The results show that a 200 nm rough tungsten coating wasformed on the surface of the diamond. The density of the tungsten-coated diamond/WeCu FGM, obtainedby microwave sintering at 1200 C for 30 min, was 94.66%. The thermal conductivity of the fourlayereddiamond/WeCu FGM was 220 W$m-1$K-1, which is higher than that of the four-layered W/CuFGM (209 Wm 1 K 1). This indicates that adding an appropriate amount of tungsten-coated diamond tothe high Cu layer W/Cu FGM improves the thermal conductivity of the composite. The diamond/WeCuFGM sintered at 1200 C for 10 min exhibited better thermal shock resistance than diamond/WeCu FGMsintered at 1100 C for 10 min