Comparative study on the bonding property of laser and reflow soldered Sn-3.0Ag-0.5Cu/Ni–P microbumps after isothermal aging and multiple reflowing
- Resource Type
- Article
- Source
- In
Journal of Materials Research and Technology March-April 2024 29:2868-2878 - Subject
- Language
- ISSN
- 2238-7854